High Temperature Resistance Tape Series
Adhesive Tape Die-Cutting Series
Adhesive tape die-cutting series · 胶带模切系列
Technical parameters
| Item | Specification |
|---|---|
| Base material | PI, PET, EVA foam, copper foil, conductive adhesive… |
| Thickness | Customisable |
| Adhesive system | Silicone / Acrylic / conductive / water-based / oil-based adhesive |
| Heat resistance | Depends on material |
Product characteristics
Precisely die-cut from a range of substrates including PI, PET, foam and conductive adhesive. High-temperature resistance, insulation, shock- and dust-proof sealing, stable adhesion with no residual adhesive.
Complies with RoHS environmental standards, holds precise dimensional tolerances, and can be customised as an integrated solution with adhesive lamination, compositing and slitting.
Applications
After die-cutting, widely used in lithium batteries, PCB circuit boards, 3C digital products and new-energy home appliances — for insulation and heat isolation, shock buffering, conductive shielding and dust-proof fixing.
Custom irregular die-cut parts such as adhesive gaskets, insulating paper, gold-finger tabs and foam sealing rings are available, with no residual adhesive after peeling.
High Temperature Resistance Tape Series
PI Gold Finger High-Temperature Tape
PI gold finger high temperature tape (Polyimide tape) · 聚酰亚胺胶带
- Base material
- PI
- Thickness
- 0.03 – 0.2 mm / customisable
- Adhesive system
- Silicone / Acrylic
PI Film (Polyimide Film)
PI Film (Polyimide Film) · 聚酰亚胺薄膜
- Base material
- PI
- Thickness
- 0.0125 – 0.15 mm
- Heat resistance
- 350 °C
PET (Polyester) High-Temperature Tape
PET (Polyester) High Temperature Resistant Tape · 聚酯高温胶带
- Thickness
- 0.05 – 0.15 mm (customisable)
- Width × Length
- Customisable
- Short-term heat resistance
- 200 °C