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PI Gold Finger High-Temperature Tape

High Temperature Resistance Tape Series

PI Gold Finger High-Temperature Tape

PI gold finger high temperature tape (Polyimide tape) · 聚酰亚胺胶带

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Technical parameters

ItemSpecification
Base materialPI
Thickness0.03 – 0.2 mm / customisable
Adhesive systemSilicone / Acrylic
Peel force1 – 8 N / 25 mm
Heat resistance150 – 260 °C

Product characteristics

High dielectric strength; no residual adhesive on tear-off; withstands 500 °F (260 °C) and higher; Class H insulation; widths supplied to customer specification for surface mounting.

Used to protect gold fingers during wave and reflow soldering. Suitable for Class H insulation and bonding of electrical switches, motors, transformer relays, cables, coils, capacitors and lithium batteries.

Applications

  1. Capacitor electrical insulation material; masking protection for PCB gold fingers during high-temperature spraying.

  2. Circuit-board masking during wave and dip soldering; protects gold fingers and insulates certain electronic components.

  3. Motor insulation, solder masking on circuit boards, transformer coil wrapping, motor coil fixing and lithium battery pack bundling.

  4. Excellent electrolyte resistance — applied to the head of electrode coating knives for insulation protection and fixing.

High Temperature Resistance Tape Series